Fluxless/Formic Reflow Ovens | manufacturer: Heller Industries

Heller Industries has developed a vacuum module that inserzs directly in its reflow oven line to meet new rising demand of high volume, void-free, automated inline soldering.

Vacuum module can be inserted in zone directly after reflow peak (liquidus) has occurred or an IR Panel can bed added to the chamber to reach reflow peak under vacuum.

Convection reflow with vacuum module is continuous and allows thermal profiles to be directly ported from non-vacuum reflow applications to achieve low COO and high UPH.

Features: Heller Industries provides optimized cycke (average 30s – 60s) to achieve super high UPH.

Reflow time under vacuum of 15 seconds was able to achieve >1% total void area spec.

Heller adopts high efficient flux collection system to collect the fluc and keep tunnel clean. On-the-fly maintenance is available.

Chamber exhaust fore line, ball valve, butterfly valve and dry vacuum pumps are heated to 150 degrees C to eliminate flux condensation.

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